2023 International Conference on Electronics Packaging (ICEP) 
April 19-22, 2023, | Kyushu, Japan

We had a very successful week in Japan during the ICEP conference. CEO Shekhar Chandrashekhar, Shanghai-based Director of Project Management and APAC Operations Haley Fu, and Japan-based Project Manager Masahiro Tsuriya attended the conference where INEMI had several presentations showcasing the work of some of our collaborative projects (see below for links to papers). We also had the chance to meet several people from our member companies at the conference and made a few site visits to members in the area. Thanks to AGC Chemicals, Amkor, DuPont, Panasonic and Resonac for their hospitality.

WA1: INEMI Session
Wednesday, April 19

WA1-1 Preparing for 6G: Developing Best Practices and Standards for Industrial Measurements of Low-Loss Dielectrics
Presented by Nate Orloff, National Institute of Standards and Technology
Co-authors:
Lucas Enright, NIST
Marzena Olszewska-Placha, QWED
Michael Hill, Intel 
Say Phommakesone, Keysight Technologies 
Daisuke Kato, Keysight Technologies
Charles Hill, 3M 
Hanna Kahari, Nokia 
Chiawen Lee, Industrial Technology Research Institute (ITRI)
Chang-Sheng Chen, Industrial Technology Research Institute (ITRI)
Nate Orloff, NIST 
Malgorzata Celuch, QWED
Urmi Ray, INEMI 
Project: 5G/mmWave Materials Assessment and Characterization


WA1-2 AOI Pattern Detection Study for Fine Pitch Advanced Substrate
Presented by Feng Xue, IBM
Co-authors:
Zhihua Zou, Intel
Neil Tang, AT&S
Billy Cheng, Unimicron
ChaoLin Cheng, Unimicron
Steven R Martell, Nordson
Masahiro Tsuriya, INEMI 
Charles Reynolds, IBM
Glenn Pomerantz, IBM
Thomas Wassick, IBM
Project: Panel Level Package Fine Pitch Substrate Inspection/Metrology, Phase 4


WA1-3 Adhesion Measurement Study for Advanced Substrate Circuitry Patterns
Presented by Masahiro Tsuriya, INEMI
Co-authors:
Lisa Chen, Intel 
Tzu-Hsuan Wang, Unimicron 
Yanchun Deng, AT&S
Iqbal Mokhtar, Intel 
Jeongmin Lim, DuPont 
Steven R Martell, Nordson
Project: RDL Adhesion Strength Measurement Project


WA1-4 An In-containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305 
Presented by Sze Pei Lim, Indium Corporation
Co-author:  Hongwen Zhang, Indium 
Project: Low Temperature Material Discovery and Characterization for First Level Interconnect

Friday, April 21, 2023
Session FE1: Solder 1

FE1-3 Electromigration In Tin-Bismuth Planar Geometry Solder Joints 
Presented by Prabjit Singh, IBM     paper      presentation
Co-authors:
Larry Palmer. IBM
Mehdi Hamid, IBM
Tom Wassick, IBM
Raiyo F Aspandiar, Intel
Brian Franco, Intel
Haley Fu, INEMI
Richard Coyle, Nokia 
Faramarz Hadian, SUNY Binghamton
Vasu Vasudvan, Dell Technologies
Aileen Allen, HP
Keith Howell, Nihon Superior
Kei Murayama, Shinko Electronic Industries
Hongwen Zhang, Indium Corporation
Anna Lifton, MacDermid Alpha Electronics Solutions
Morgana Ribas, MacDermid Alpha Electronics Solutions
Murali Sarangapani, Heraeus Materials 
Terry Munson, Foresite
Steven Middleton, Foresite
Project: Electromigration of SnBi Solder for Second-Level Interconnect